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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
Notice
Continued from the preceding page.
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
a=20 to 70μm
C02E.pdf
Sep.25,2013
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
Chip Capacitor
Adhesive
b=30 to 35μm
c=50 to 105μm
a
c
b
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa s (500ps) min. (at 25°C).
3. Adhesive Coverage
Size (L g W) (in mm)
Adhesive Coverage*
1.6 g 0.8
0.05mg min.
2.0 g 1.25
0.1mg min.
3.2 g 1.6
0.15mg min.
*Nominal Value
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
4. Flux Application
Board
Land
1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of solder ability,
so apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering.)
2. Flux containing too high a percentage of halide may
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.1%
max.
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux
including wash-type flux and non-wash-type flux.)
[As a Single Chip]
A
B
D
C
Outer Electrode
[As Mounted on Substrate]
B
A
Continued on the following page.
156
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